PCB Manufacturing Services
Rigid, flexible and specialty printed circuit boards from prototype to production. Every order starts with an engineering review of your data, stack-up and requirements before quotation.
PCB manufacturing with ShinePCB
Share Gerber or ODB++ data with a fabrication drawing and quantity. Our engineers check manufacturability, confirm materials and stack-up, and raise questions before a quotation is issued, so the confirmed order matches what you need.
Sample and production requirements are reviewed separately, and special processes are confirmed for each project.
Board types
Multilayer PCB
Multilayer boards for dense routing, power distribution and signal isolation, built to the stack-up agreed in engineering review.
- Stack-up proposed or checked against your targets
- Material selected for the application
- Layer count confirmed per project
HDI PCB
High-density interconnect boards for compact layouts and fine-pitch components.
- Via structure reviewed before quotation
- Fine-line routing checked in DFM
- Feasibility confirmed per design
Rigid-Flex PCB
Combined rigid and flexible sections that remove connectors and cables from compact assemblies.
- Bend areas and transitions reviewed
- Construction agreed with your drawing
- Assembly constraints discussed early
Flexible PCB (FPC)
Flexible circuits for moving parts, tight spaces and lightweight designs.
- Coverlay and stiffener options reviewed
- Bend requirements clarified
- Material confirmed per project
High-Frequency PCB
Boards for RF and microwave designs where dielectric properties and loss matter.
- Laminate options reviewed against your targets
- Hybrid stack-ups discussed when useful
- Material availability checked before quotation
High-Speed PCB
Boards for fast digital interfaces where signal integrity depends on materials and geometry.
- Low-loss material options reviewed
- Impedance targets checked with the stack-up
- Back drilling discussed where needed
Heavy Copper PCB
Boards for power electronics and high-current paths that need thicker copper.
- Copper weight and trace geometry reviewed
- Thermal needs discussed with engineering
- Parameters confirmed per project
Metal Core PCB
Metal base boards that move heat away from LEDs, power devices and drivers.
- Base material and dielectric options reviewed
- Thermal requirements clarified
- Construction confirmed per project
Backplane PCB
Large, thick boards that connect cards and modules in communication and computing systems.
- Stack-up and board thickness reviewed
- Press-fit and back drilling needs discussed
- Feasibility confirmed per design
Prototype & Quick-Turn
Early builds that validate your design, with the path to production planned from the first review.
- Prototype and production requirements kept separate
- Design feedback shared before the build
- Schedule confirmed in the quotation
Manufacturing capability by board type
2025 capability values from the ShinePCB workbook, with prototype and mass-production limits in separate columns.
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count (max) | 48L | 36L |
| Finished board thickness | 0.2–15.0 mm | 0.3–7.0 mm |
| Thickness tolerance | ±8% | ±8% |
| Min trace / space | 1.5 / 1.5 mil | 2 / 2 mil |
| Min hole-to-trace clearance | 5 mil | 5 mil |
| Copper weight | 1–12 oz | 1/3–8 oz |
| Layer registration accuracy | 0.8 mil | 1 mil |
| Min through-hole diameter | 0.075 mm | 0.10 mm |
| Min blind / buried via diameter | 0.05 mm | 0.075 mm |
| Max aspect ratio | 35:1 | 30:1 |
| Etching tolerance | ±10% / ±0.8 mil | ±10% / ±1 mil |
| Min solder mask bridge | 2 mil | 3 mil |
| Impedance control tolerance | ±5% | ±7% |
| HDI level | 9th order | 5th order |
| Surface finish | ENIG, hard gold, immersion tin, immersion silver, OSP, carbon | ENIG, hard gold, immersion tin, immersion silver, OSP, carbon |
| Material types | Shengyi, Taiwan Union, ITEQ, Nan Ya, Rogers, Panasonic, Isola (Tg135 / Tg150 / Tg170, CAF / CTI>600, halogen-free) | Same material families as prototype |
Source: ShinePCB capability workbook, 2025 values. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count (max) | 20L | 18L |
| Panel size | 400 × 540 mm | 400 × 540 mm |
| Finished board thickness | 0.25–5.0 mm | 0.25–3.2 mm |
| Min trace / space | 1.5 / 1.5 mil | 2 / 2 mil |
| Min hole-to-trace clearance | 4 mil | 5 mil |
| Copper weight | 1/3–3 oz | 1/3–2 oz |
| Layer registration accuracy | 0.8 mil | 1 mil |
| Min through-hole diameter | 0.075 mm | 0.10 mm |
| Min laser via diameter | 0.05 mm | 0.05 mm |
| Max aspect ratio | 16:1 | 12:1 |
| Etching tolerance | ±10% / ±0.8 mil | ±10% / ±1 mil |
| Min solder mask bridge | 2 mil | 3 mil |
| Impedance control tolerance | ±5% | ±7% |
| Surface finish | ENIG, hard gold, immersion tin, immersion silver, OSP, carbon | ENIG, hard gold, immersion tin, immersion silver, OSP |
| Supported structures | Single-sided core, symmetrical and asymmetrical stack-ups, multilayer, gold finger, air gap, HDI, build-up, bookbinder, high-speed design | Same structures as prototype |
| Material types | Shengyi, Ventec, Taiwan Union, ITEQ, Panasonic, Rogers, Isola, Arlon | Same material families as prototype |
Source: ShinePCB capability workbook, 2025 values. Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
| Parameter | Prototype | Mass production |
|---|---|---|
| Layer count (max) | 12 | 16 |
| Min dielectric thickness | 12.5 µm | 12.5 µm |
| Min BGA pitch | 150 µm | 100 µm |
| Min board thickness | 50 µm | 50 µm |
| Max panel size | 610 × 1200 mm | 610 × 1200 mm |
| Base copper thickness | 9–35 µm | 6–35 µm |
| Min trace / space | 40 / 40 µm | 35 / 35 µm |
| Pattern registration tolerance | ±50 µm | ±20 µm |
| Min pattern-to-edge clearance | 0.10 mm | 0.07 mm |
| Etching tolerance | ±20 µm | ±15 µm |
| Min through-hole diameter | 0.10 mm | 0.075 mm |
| Min blind via diameter | 0.05 mm | 0.05 mm |
| Hole diameter tolerance | ±0.05 mm | ±0.05 mm |
| Impedance control tolerance | ±10% | ±5% |
| Outline tolerance | ±0.10 mm | ±0.05 mm |
| Surface finish | HASL, ENIG, immersion silver, OSP, ENEPIG, hard gold | HASL, ENIG, immersion silver, OSP, ENEPIG, hard gold |
| Stiffener type | FR-4, PI, stainless steel | FR-4, PI, stainless steel |
| Stiffener registration tolerance | ±0.20 mm | ±0.10 mm |
| HDI capability | 4-layer any-layer interconnect | 6-layer any-layer interconnect |
| LCP material | Supported | Supported |
Source: ShinePCB capability workbook (FPC sheet has no year column). Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
| Parameter | Prototype | Mass production |
|---|---|---|
| Material system | PTFE, hydrocarbon resin, other materials | PTFE + ceramic, PTFE + glass fiber + ceramic, PTFE + glass fiber |
| Layer count (max) | 24L | 20L |
| Panel size (max) | 850 × 700 mm | 720 × 650 mm |
| Profile tolerance | ±0.05 mm | ±0.10 mm |
| Slot tolerance | Normal slot ±0.08 mm, routed slot ±0.10 mm | Normal slot ±0.10 mm, routed slot ±0.13 mm |
| Layer registration | 2 mil | 3 mil |
| Hybrid lamination | PTFE + glass ceramic + FR-4 | PTFE + glass ceramic + FR-4 |
| Min hole size | 0.075 mm | 0.10 mm |
| Min hole spacing | 0.20 mm | 0.25 mm |
| Hole diameter tolerance | ±0.05 mm | ±0.075 mm |
| Max aspect ratio | 16:1 | 12:1 |
| Hole copper uniformity | COV ≤ 5% | COV ≤ 7% |
| Resin-filled via aspect ratio | 12:1 | 12:1 |
| Resin-filled via type | Through hole / blind via | Through hole / blind via |
| Trace width tolerance | ±0.6 mil | ±1 mil |
| Impedance tolerance | ±5% | ±8% |
| Warpage | 0.50% | 0.75% |
| Special processes | POFV (VIPPO), sequential lamination, local lamination, long/short gold finger, counterbore, back drill, side metallization, N+N structure, edge plating, thick copper, HDI | Same processes as prototype |
| Approved material brands | Shengyi, ITEQ, Taiwan Union, Panasonic (M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola | Same brands as prototype |
Source: ShinePCB capability workbook (high-frequency & high-speed sheet has no year column). Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
What to send
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and production
- Special requirements such as testing or packaging
Start a new PCB project
Share the details you have. Engineering reviews your requirements and raises questions before quotation.
PCB FAQs
Do you issue an instant price?
No. Each project is reviewed by engineering first, and the quotation confirms scope, price, lead time and terms before payment.
Can you suggest a stack-up?
Yes. Share your layer count, thickness and impedance targets and we will propose or check a stack-up during review.
How are my files handled?
Technical files are kept out of public links and shared only within your project. Please do not send them through public channels.
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
